Evaluation of Interfacial Adhesion between Si Substrate and Organic Polymer Dielectric Film
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چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Journal of the Japan Institute of Metals and Materials
سال: 2004
ISSN: 0021-4876,1880-6880
DOI: 10.2320/jinstmet.68.462